ldbk2640/s77 round type led lamps data sheet 21 - dec. doc. no : qw0905- rev. : date : a - 2007 ldbk2640/s77 ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
ligitek electronics co.,ltd. property of ligitek only package dimensions page 1/5 part no. ldbk2640/s77 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 6.8 0.5 2.54typ - + 3.1 2.9 4.3 3.3 3.8 0.3 0.5 typ
parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) storage temperature ingan/gan material operating temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) ldbk2640/s77 part no forward current v 150 esd luminous intensity @5ma(mcd) forward voltage @20ma(v) blue diffused blue color emittedlens 470303.54.0 spectral halfwidth nm wave length nm d dominant typ. max. 38 300 160 viewing angle 2 1/2 (deg) typ. min. t opr tstg -30 ~ +100 -20 ~ +80 ir pd i fp i f 120 50 100 30 symbol dbk ratings a mw ma ma unit page2/5 ligitek electronics co.,ltd. property of ligitek only * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no. ldbk2640/s77
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page3/5 part no. ldbk2640/s77
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 preheat 50 100 2 /sec max temp( c) 260 260 c3sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 4/5 part no. ldbk2640/s77
this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec high temperature high humidity test thermal shock test solder resistance test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only 5/5 page part no. ldbk2640/s77
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